When I got this I they had a larger model (twice the size) under way. So far I do not see it being available. Being larger it will probably take longer to heat.
The thing that I find very appealing about it is the simplicity. Maybe because I came from a pimped-up toaster oven. It had a PID controller, but I always needed to place the PCB exactly in the middle, attach the temp wire to a place central in the PCB and hope for the best. It mostly did the job but it cooled badly, so I always had to stay with it and open the door manually to prevent the PCB from overheating after soldering. But still components overheated (lost their marking) while others did not solder (switches, larger fets). The white silk screen always came out slightly darker.
In comparison, with the vapor flow I place the PCB. Then turn on the fume extractor and the oven, select a profile and press start. I then go do something else, to come back 15 minutes later and find a nicely soldered PCB. Components large and small, no problem. Sometimes some solder balling, but that is easily sorted.
A while ago I blew a smart switch (TO252-5) on a proto I was torturing. This being a 4 layer PCB with a lot of thermal vias and cooling surfaces, it took a very large solder tip and quite some time to remove the component. Which made me question the feasibility of a soldering iron to get the new component on. So in the end I thought, what the h*ll, put some solder paste on the PCB, replaced the TO252-5 and put the PCB in the vapor phase oven for a second round. The results were amazing. The new component was soldered perfectly. All other SMD components were fine. PCB switches were fine. Most connectors were fine. All Molex KK connectors, the white ones, were affected. They now stand on the PCB like gravestones on a 150-year old graveyard. Still usable though. Next time I'll use the black ones. The only component that I had to replace was a thru-hole Recom DC-DC converter. Its housing was fine but it had completely melted off its legs.
For my use I like a vapor phase oven a lot better than my previous oven.
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Reflow Soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil.
The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional reflow soldering process, there are usually four stages, called &#;zones&#;, each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
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Integrated microprocessor for profile control and storage.
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