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Author: Marisa
Nickel plating can be carried out by roller plating or continuous plating.
I. The concept of roller plating and continuous plating
Roll plating is to roll the material to be nickel-plated on a roller, and the nickel is deposited on the material through the action of the roller and the electrode.
Continuous plating is to pass the material through the plating tank and nickel-plate it in a continuously flowing liquid. The plating solution and nickel plating process of the two methods are slightly different.
II. Advantages and disadvantages of roll plating and continuous plating
1. Advantages of roll plating:
① The nickel layer has uniform thickness and can be plated with a nickel layer as thin as 0.1 micron
② The coating structure is dense, without defects such as holes, inclusions, and microcracks
③ Short duration and high production efficiency
2. Disadvantages of roll plating:
① Only suitable for small, flat, and complex-shaped materials
② Limited processing capacity and certain restrictions on coating thickness
③ High cost, requiring more manpower, materials, and equipment investment
1. Advantages of continuous plating:
① Suitable for materials of different shapes, sizes, and thicknesses
② High production efficiency, generally can meet mass production
③ The coating is stable, uniform, and densely structured, which can ensure the quality of the product
2. Disadvantages of continuous plating:
① The coating thickness is relatively limited to roll plating
② Large equipment requires a larger production space
III.Application scenarios
Roll plating is mainly used to manufacture microelectronic devices, optical instruments, and precision instruments, etc.
Continuous plating is mainly used to manufacture electroplated thermal insulation layers, anti-oxidation layers, planar radio frequency circuits, high-temperature alloys, etc.
[Conclusion] The two nickel plating methods have their own characteristics and can be selected according to needs. Roll plating is suitable for small, flat, and complex-shaped materials, and is suitable for the manufacture of microelectronic devices, optical instruments, and precision instruments, etc.; while continuous plating is suitable for materials of different shapes, sizes, and thicknesses, and is mainly used to manufacture electroplated thermal insulation layers, anti-oxidation layers, planar radio frequency circuits, high-temperature alloys, etc.