Sputtering target is a physical vapor deposition (PVD) process to form thin films. Thickness of layer formed varies from a few nano-meters up to several microns.
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Sputter PVD consist of collisions of ions in vacuum and a plasma environment under strong magnetic field in order to extract atoms from the target and gradually grow a thin film over the desired substrate.
Scientific researchers generally use small discs (typical diameters ranges from 0.25 to 2, 3 or 4 inches) as sputter targets.
Nonetheless, myriad of targets shapes are possible, such as small cylinders, hollow tubes (rotatable targets) and long plates according to the industrial application and the continuous or batch deposition process. Powder metallurgy is the common process to manufacture most targets.
Sputtering Target: uses & manufacturing process
Even though Grove and Faraday first reported the sputtering phenomenon, it was Edison who managed to file the first patent in , pertaining to a sputtering process by arc deposition and thermal evaporation method from a solid surface. Today microelectronics, photovoltaic, optics, metal and tribology sectors all make use of PVD thin film deposition.
Sputtering target materialsAt PhotonExport, we offer a premier range of sputtering target materials. Our collection includes high-purity metals like Aluminum, ranging from 99.99% to 99.% in purity, to Antimony with purities of 99.999- 99.%, and more.
If you want to learn more, please visit our website Advanced Targets.
Beyond metals, our diverse alloy selection showcases combinations such as Aluminum-Chromium (AlCr) at 99.99%, and much more. We also provide specialized materials, from antimonides like Gallium Antimonide (GaSb) to selenides, silicides, sulfides, and tellurides.
View our wide selection of sputtering targets today: PhotonExport Sputtering Targets
&#;Target&#; in &#;sputtering target&#; is derived from the shooting target, which is very common in our lives. In the process of PVD, the coating material is bombarded by an electron beam or ion beam, just like the target being shot, so much material got its name as &#;target&#;. That's why they call this material a "sputtering target." After knowing where the name came from, you may think &#;sputtering target&#; is not weird anymore.
Heeger Materials Inc., is a professional supplier and manufacturer of high-quality Sputtering Targets including high-quality Tantalum (Ta) Sputtering Target, Antimony (Sb) Sputtering Target, ITO Sputtering Target, Gadolinium (Gd) Sputtering Target, Chromium (Cr) Sputtering Targets etc., leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction. You can safely choose to buy Sputtering Targets from Heeger Materials Inc..
The sputtering target is a broad concept, including many categories such as metal sputtering target, alloy sputtering target, ceramic sputtering target, and so on. Practically any material alloy, mixture, pure metal, oxide, nitride, boride, or carbide can be supplied as a sputter target.
Sputtering targets are mainly used in flat panel displays, optical components, energy-saving glass, semiconductors, solar cells, and other industries; used for the preparation of magnetic materials; used for decorative coatings, such as the preparation of metal films on ceramics, glass, and metal products; used for the preparation of protective coatings, such as on glasses, masks, car windows, and other products; used for the preparation of conductive films, such as in touch screens, flexible electronic devices and other applications.
Heeger Materials Inc. combines different technologies to produce sputtering target materials. The Sputtering target is a material used in the physical vapor deposition (PVD) process to coat thin films on various surfaces. In this section, we combine melting, sintering, synthesis, and machining technologies to produce sputtering target products of different materials, purity, and shapes. The choice of manufacturing process depends on the material characteristics and the final application. Various types of sputtering target materials can also be produced using these manufacturing processes: conventional and vacuum hot pressing, cold pressing and sintering, as well as vacuum melting and casting.
State-of-the-art powder mixing and/or alloying through sintering and/or melting of raw materials and subsequent grinding allow us to meet the highest quality standards. Each production lot of material is sent through various analytical processes, and a certificate of analysis is provided with each shipment.
Grain structure is a key factor in a sputtering target&#;s process performance. Finer grain sizes reduce variation in film uniformity and deposition rates. Random, or equiaxed, grain orientation also improves film uniformity. Properly controlling the grain structure of the target enables higher-yielding, more consistent deposition processes.
We use a variety of advanced manufacturing methods to produce sputter targets with an excellent grain structure and from our broad portfolio of sputtering target materials in nearly any shape or size. Please contact us if your required sputtering target material or purity is not listed.
Heeger Materials Inc., a professional supplier and manufacturer of high-quality Sputtering Target Materials, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction. You can safely choose to buy Sputtering Target from Heeger Materials Inc.
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